Consultings

Scope:

Laser micromachining with its extensive possibilities for high-precision component manufacturing is used in many fields. The use of ultrashort pulse laser systems enables high-precision processing of any material, including transparent materials and thin layers, without undesirable thermal influence on the base material. Applications range from drilling the smallest nozzle holes to cutting any material with high precision or microstructuring to adapt surface properties and interface optimization in material composites. Microjoining of different material combinations by fine welding is also possible with the laser. Analytics using high-speed camera technology opens up in-depth insights into fast-running processes and complements our capabilities in process development.

Approach:

Laser Micro Cutting 

• Plastic films (e. g. PDMS, PS, PLA) for the production of microfluidics for lab-on-a-chip systems
• Teflon impression masters for imprint technology and microfluidic applications
• Temperature-sensitive solder foils and reactive multilayers for joining applications
• Semiconductor and wide-bandgap semiconductor wafers for electronic industry
  

Laser Micro Drilling

• Nozzle configurations
• Apertures for optical and analytical applications
• Electrical vias in ceramic and semiconductor substrates
• Drilling and perforating of plastic foils for microfluidic applications

Laser Structuring

• Customized surface structures increase joint strength
• Surface structuring, e. g. optimization of production of structures for guiding cell growth and textured surfaces to improve the performance of battery cells and fuel cells
• Shaping by material removal for the production of molding and cutting tools made of hard materials such as ceramics or hard metals

Laser Decoating and Cleaning

• Laser cleaning for technical and restoration applications
• Technical laser cleaning: More information at: Fraunhofer-Business Area Cleaning
• Restorative laser cleaning of art and cultural object

Laser Functionalization and Modification

• Generation of functional groups by laser irradiation under reactive gas atmosphere
• Excitation of polymerization of monomers

High-speed Camera Technology

• Process analysis on highly dynamic processes such as remote laser cutting, rapid prototyping and laser welding

Outcome:

Fraunhofer IWS enginieers utilize comprehensive high end equipment as well as long year experience to perform applied research projects in the field of micro patterning and precision machining with (ultra)short pulsed laser beams. Targeted applications are the miniaturization of functional elements in machines, systems, vehicles, instruments and medical devices. Examples include the fabrication of 3D structures of micro millimeter dimensions and surface texturing on polymers, metals, ceramics and quartzite and biocompatible materials. Laser based cleaning and coating removal processes are further fields of development. To the same extent as structuring, diagnostics is crucial for understanding processes and samples. Therefore, the working group has specialized in optical laser process characterization with high-speed camera technology.

In an application-oriented manner, we accompany our partners from initial feasibility studies through process development to implementation in series production. We efficiently contribute our expertise and many years of experience to projects with industrial customers and within