Aim: To design and optimize a dual laser-assisted process for welding and sealing glass substrates in electronics and photovoltaics.
Brief description: The LaserEncap project focuses on advancing laser-assisted glass encapsulation technology. The method involves using two laser beams to melt a glass frit sealant, achieving a hermetic bond between two glass substrates. This innovative dual-beam approach enhances processing yields, making it suitable for applications in solar photovoltaics and OLED devices. The project builds on an existing proof of concept and aims to refine the process for industrial scalability.
Benefits: The dual-beam laser method increases processing efficiency and yield, enabling more reliable and scalable production of encapsulated electronics and photovoltaic devices. This innovation supports the development of advanced energy solutions like dye-sensitized and perovskite solar cells, promoting sustainability and efficiency in renewable energy technologies.
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