Aim: To optimize liquid-assisted laser processing for cutting and drilling thick and brittle wafers to enhance production yield and reduce manufacturing waste.
Brief description: The project focuses on refining a proprietary liquid-assisted laser ablation technique to address challenges in processing brittle wafers like LiNbO3 used in photonic, piezoelectric, and electro-optic devices. By optimizing the wafer holding system and process parameters, the project aims to minimize edge chipping and fracturing, enabling repeatable and high-precision cutting and drilling for small-batch production. This innovation directly supports the semiconductor industry's demand for more sustainable and efficient fabrication methods.
Benefits: The optimized process increases production yield from 40% to over 83%, significantly reducing waste and material costs. It enhances the resilience and independence of the European semiconductor industry while aligning with net-zero strategies through sustainable manufacturing practices. Additionally, the improved precision and repeatability ensure consistent quality, supporting advanced semiconductor applications.
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